Mold parallel linker 2.0.0 released; mold transitions from AGPL to MIT

2023/07/26

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Mold 2.0.0, a high-speed linker, has released its new major version with several updates. The most significant change is the transition of the license from AGPL to MIT. This decision was made to expand the user base of the linker, as the previous attempt to monetize the product through a dual-licensing scheme did not meet expectations.

The article highlights the importance of the license change and the acceptance of the reality that the previous strategy did not work well. The author encourages users who are happy with the license change to consider becoming GitHub sponsors.

In addition to the license change, the article mentions that Mold 2.0.0 includes various updates, but does not provide specific details. Developers interested in using Mold as a linker should consider this new release and its license change, as it may affect their decision to adopt the framework.

Overall, the article showcases the latest release of Mold parallel linker and its transition from AGPL to MIT license, providing developers with important information to keep up with the latest news in the industry.